Hot Spot Removal in Power Electronics by means of Direct Liquid Jet Cooling
Piscataway, NJ / IEEE (2017) [Contribution to a book, Contribution to a conference proceedings]
Proceedings of the Sixteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2017 : May 30-June 2, 2017, Orlando (Lake Buena Vista), FL, USA / IEEE, IEEE Components, Packaging and Manufacturing Technology Society
Page(s): 471, 11 Seiten
de Doncker, Rik W.